Common materials used for plastic carrier tapes include polycarbonate (PC), polystyrene (PS), ABS (acrylonitrile-butadiene-styrene copolymer), and HIPS (high-impact polystyrene). Polycarbonate is characterized by high strength, excellent dimensional stability, and low shrinkage; typically, its shrinkage rate remains minimal even after being subjected to +85°C for 24 hours. This makes it suitable for housing precision chips and bare dies-such as chiplets, WLCSPs, and BGAs-and allows for the maintenance of strict dimensional tolerances. Polystyrene carrier tapes, in contrast, exhibit a relatively higher shrinkage rate under the same conditions. ABS and HIPS resins can be modified to impart conductive or anti-static properties.
Paper carrier tapes offer advantages such as good resilience, low cost, and eco-friendliness, though they possess relatively lower mechanical strength. Quality requirements for paper carrier tapes include an internal bond strength of ≥150 J/m², a surface smoothness of ≥500 s, and a surface strength (measured via the wax pick test) of ≥Grade 16. Furthermore, strict controls must be applied to minimize paper dust generation (≤100 mg/kg) and limit residual ion content (e.g., SO₄²⁻ ≤500 mg/kg).
To meet diverse application requirements, carrier tapes are available with various properties, including insulation, anti-static (static-dissipative), or conductive characteristics. Surface resistivity serves as a critical performance metric; anti-static (static-dissipative) carrier tapes typically feature a surface resistivity ranging from 10⁴ Ω/sq to 10⁸ Ω/sq, enabling them to dissipate static charges accumulated through triboelectric effects and thereby protect ESD-sensitive devices.
Cover tapes are primarily categorized into heat-activated adhesive (HAA) cover tapes and pressure-sensitive adhesive (PSA) cover tapes. In automated carrier tape bonding technologies (such as Tape Automated Bonding, or TAB), base tape materials-such as polyimide or polyester films-are utilized; these materials are required to exhibit high thermal resistance, low shrinkage, and excellent adhesion to metal surfaces.
