Material Options

SMD embossed carrier tape is typically manufactured from thermoplastic materials such as PS (Polystyrene), PC (Polycarbonate), PET, or ABS. These materials offer good forming characteristics and mechanical strength, making them suitable for packaging small electronic components.

Different materials may be selected depending on the application requirements, including pocket strength, transparency, and forming stability.

For applications involving sensitive electronic devices, the tape can also be produced with antistatic or conductive properties to help reduce electrostatic discharge during handling and packaging.

Pocket Structure

Embossed carrier tape is produced through a thermoforming process that creates precisely shaped pockets in the plastic tape.

These pockets are designed according to the size and geometry of SMD components to ensure:

stable positioning of components
protection during transportation
reliable feeding during automated assembly

Standard sprocket holes along the tape edges allow accurate indexing when the tape moves through SMT pick-and-place machines.

This ensures consistent feeding performance in high-speed SMT production environments.

Specifications

Item	Specification
Material	PS / PC / PET / ABS
ESD Property	10⁶ – 10¹¹ Ω
Tape Width	8 mm – 120 mm
Thickness	0.25 mm – 1.0 mm
Pocket Depth	1 mm – 40 mm
Color	Black / Transparent
Length	1 – 1000 m per reel
Standard	EIA-481