Carrier Tape Selection Requirements

Jan 06, 2026

Leave a message

Carrier tape is a critical packaging material used in SMT (Surface Mount Technology) production to carry and transport electronic components. Its selection directly affects automated placement efficiency, component safety, and overall yield.

 

General-purpose MLCC/Resistor/Capacitor Carrier Tape: PET material is optional (low cost, good moisture resistance). Precision requirements are relatively relaxed; commonly used widths are 8–24mm.

 

Connector/Irregularly Shaped Component Carrier Tape: Requires "foolproof bevel" + "clip cap structure," bandwidth 12–56mm, PC thick sheet (0.3–0.5mm) is recommended.

 

Carrier Tapes for SMD LEDs: These require high light transmittance or a white reflective layer to enhance light efficiency, as well as static control (surface resistivity: 10⁴–10⁹ Ω); the mainstream solution utilizes a white PC or PET substrate with a conductive coating.

 

Dedicated Carrier Tape for ICs: Suitable for chips such as QFN, BGA, and CSP; requires high-precision pockets (±0.02 mm) as well as anti-static or conductive properties. Commonly available in widths of 8–16 mm and thicknesses of 0.3–0.5 mm; PC material is recommended.

 

Carrier Tapes for Power Inductors/Magnetic Components: These require increased wall thickness (≥0.35 mm) and the inclusion of "cushioning pads" to prevent chipping of the magnetic core corners.

 

Carrier Tapes for Transistors: Designed for leaded devices such as SOT and SOD packages, these tapes incorporate "anti-twist ribs" and "positioning posts" to prevent lead deformation; the pitch (spacing) is typically a multiple of 3 mm or 4 mm.

Send Inquiry